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Title edit
ACCRETECH
Description edit
Excerpted from the website:
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- Wafer probing machines, wafer dicing machines, wafer inspection system, polish grinders, chemical mechanical planarizers (CMPs), wire slicing machines*, wafer slicing machines*, wafer edge grinding machines*
- Coordinate measuring machines, surface texture and contour measuring instruments, roundness and cylindrical profile measuring instruments, optical parts measuring instruments, machine control gauges*, various types of sensors*
Languages edit
日本語 (Japanese)
Logos edit
