Ait.com.hk
Title
Advanced Interconnect Technology (AIT)
Description
Excerpted from the website:
- Provides custom wafer bumping and flip-chip bonding service to the semiconductor wafer fabrication and chip packaging houses.
Additional Information
Domain Resolution
This domain resolves to the following IP addresses:
Categories:
- Ait
- Advanced
- Bump
- Bumping
- Bumps
- Business
- Cob
- Cof
- Cog
- Chip On Board
- Chip On Flex
- Chip On Glass
- Components
- Copper
- Daisy Chain
- Detectors
- Die
- Electronic
- Electronics And Electrical
- Flip Chip
- Gold
- Ir
- Indium
- Infrared
- Interconnect
- Interconnections
- Lead Tin
- Materials And Supplies
- Packaging
- Semiconductors
- Single
- Solder
- Technology
- Wafer
- X Ray
- AIT
- COB
- COF
- COG
- Chip-on-Board
- Chip-on-Flex
- Chip-on-Glass
- Daisy-chain
- Electronics and Electrical
- Flip-chip
- IR
- Lead-Tin
- Materials and Supplies
- X-ray