TechStar-I.com
Title
Techstar Innovations specialises in Gold Wire Bonder, Die Bonder, Flip chip Bonder, Aluminium Wire Wedge Bonder, Gold Bonding Wire, BGA Solder Sphere Ball, Auto Molding System and Leadframe Inspection System.
Description
We are a young and energetic team with an average experience of 8 years in the industry. Despite our young establishment, our dedicated workforce has total commitment and is oriented towards customer satisfaction, hence earning the goodwill of our customers and reputation in the industry.
Three regional offices under the wing of Techstar's main Singapore office, have been newly-set up in Thailand, Philippines and China. This is to build up a regional network in order to provide better pre and after sales support to our valuable customers in the area.
Techstar Innovations is an engineering company based in Singapore, functioning as a product representative and trading firm, bringing in the latest State-of-art technology products from all over the world and to market in the Asia-Pacific region, mainly for the semiconductor industry.
Languages
English
Contact
- TECHSTAR INNOVATIONS PTE LTD
-
- SINGAPORE
- SG 079903
-
- 65-62279205
Additional Information
- Aluminium Wedge Bonder
- Aluminium Wire Bonder
- Aluminium Wire Wedge Bonder
- Bga Solder Ball
- Bga Solder Sphere
- Bga Solder Sphere Ball
- Bonders
- Bonding
- Business
- Components
- Die Bonder
- Die Bonders
- Die Bonding
- Die Bondings
- Electronics And Electrical
- Fine
- Flip Chip Bonder
- Flip Chip Bonders
- Flip Chip Bonding
- Flip Chip Bondings
- Gold Bonding Wire
- Gold Wire Bonder
- Lead Frame Inspection
- Pitch
- Semiconductor Wire Bonders
- Semiconductor Wire Bondings
- Semiconductors
- Solder Ball
- Solder Sphere
- Tools And Equipment
- Ultra
- Wedge Bonder
- Wire
- Wire Bonder
- Wire Bonders
- Wire Bonding
- Wire Bondings
- Electronics and Electrical
- Leadframe Inspection
- Tools and Equipment