ThermalSoftware.com
Title
Thermal software for electronics cooling
Description
Excerpted from the website description:
- Thermal software for electronics cooling: analysis of circuit boards (PCB), modeling of heat sinks (heatsinks), semiconductor stackups (QFP, BGA), duty cycle transient problems, boxes, enclosures and systems
Languages
English
Additional Information
External Links
Categories:
- 218
- 220 TO
- 3D
- 3 TO
- Ambient
- Analysis
- BGA
- Board
- CPU
- Circuit
- Component
- Conduction
- Conductivity
- Convection
- Cooling
- Cycle
- D2PAK
- DIP
- DPAK
- Design
- Duty
- Efficiency
- Emissivity
- Enclosure
- Factor
- Fin
- Forced
- Free
- Gray
- Heat
- Heatsink
- IGBT
- Interface
- Intermittent
- Modeling
- Natural
- Nonlinear
- PC
- PCB
- Power
- Program
- QFP
- Radiation
- Resistance
- Semiconductor
- Shape
- Sink
- Software
- Solder
- Specific
- System
- TO
- Temperature
- Thermal
- Thermalsoftware
- Theta
- Transfer
- Turbulence
- Via
- View