Difference between revisions of "Planar.by"
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| + | [[Category:Assembly]] | ||
[[Category:Business]] | [[Category:Business]] | ||
| − | [[Category: | + | [[Category:Chip]] |
[[Category:Components]] | [[Category:Components]] | ||
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[[Category:Defect Inspection]] | [[Category:Defect Inspection]] | ||
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[[Category:Dicing Saw]] | [[Category:Dicing Saw]] | ||
| + | [[Category:Die Bonder]] | ||
| + | [[Category:Electronics]] | ||
| + | [[Category:Electronics And Electrical]] | ||
[[Category:Encapsulation]] | [[Category:Encapsulation]] | ||
| − | [[Category: | + | [[Category:Exposure]] |
| − | [[Category: | + | [[Category:Forcer]] |
| − | [[Category: | + | [[Category:Ic]] |
| − | [[Category: | + | [[Category:Integrated Circuit]] |
| + | [[Category:Lcd]] | ||
| + | [[Category:Laser]] | ||
| + | [[Category:Lens]] | ||
| + | [[Category:Mems]] | ||
| + | [[Category:Mask Aligner]] | ||
| + | [[Category:Mask Making System]] | ||
| + | [[Category:Mask Repair]] | ||
| + | [[Category:Mask Writing]] | ||
| + | [[Category:Medical Equipment]] | ||
[[Category:Microscope]] | [[Category:Microscope]] | ||
| − | [[Category: | + | [[Category:Motor]] |
| + | [[Category:Mould]] | ||
[[Category:Optical Component]] | [[Category:Optical Component]] | ||
| − | [[Category: | + | [[Category:Pcb]] |
| + | [[Category:Package]] | ||
| + | [[Category:Pattern]] | ||
| + | [[Category:Pattern Generator]] | ||
| + | [[Category:Photolithography]] | ||
| + | [[Category:Photomask]] | ||
[[Category:Prism]] | [[Category:Prism]] | ||
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[[Category:Reticle]] | [[Category:Reticle]] | ||
| + | [[Category:Smd]] | ||
| + | [[Category:Smt]] | ||
| + | [[Category:Semiconductor Device]] | ||
| + | [[Category:Semiconductors]] | ||
| + | [[Category:Silicon Wafer]] | ||
| + | [[Category:Smart Card]] | ||
| + | [[Category:Stepper]] | ||
| + | [[Category:Substrate]] | ||
| + | [[Category:Surface Mount]] | ||
| + | [[Category:Tools And Equipment]] | ||
| + | [[Category:Vlsi]] | ||
| + | [[Category:Wafer Grinder]] | ||
| + | [[Category:Wire Bonder]] | ||
| + | [[Category:Defect_Inspection]] | ||
| + | [[Category:Dicing_Saw]] | ||
| + | [[Category:Die_Bonder]] | ||
| + | [[Category:Electronics_and_Electrical]] | ||
[[Category:IC]] | [[Category:IC]] | ||
| − | [[Category: | + | [[Category:Integrated_Circuit]] |
| − | [[Category: | + | [[Category:LCD]] |
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[[Category:MEMS]] | [[Category:MEMS]] | ||
| − | [[Category: | + | [[Category:Mask_Aligner]] |
| + | [[Category:Mask_Making_System]] | ||
| + | [[Category:Mask_Repair]] | ||
| + | [[Category:Mask_Writing]] | ||
| + | [[Category:Medical_Equipment]] | ||
| + | [[Category:Optical_Component]] | ||
[[Category:PCB]] | [[Category:PCB]] | ||
| − | [[Category: | + | [[Category:Pattern_Generator]] |
| − | [[Category: | + | [[Category:SMD]] |
| − | [[Category: | + | [[Category:SMT]] |
| − | [[Category: | + | [[Category:Semiconductor_Device]] |
| − | [[Category: | + | [[Category:Silicon_Wafer]] |
| − | [[Category: | + | [[Category:Smart_Card]] |
| − | [[Category: | + | [[Category:Surface_Mount]] |
| − | [[Category: | + | [[Category:Tools_and_Equipment]] |
| − | [[Category: | + | [[Category:VLSI]] |
| − | [[Category: | + | [[Category:Wafer_Grinder]] |
| − | [[Category: | + | [[Category:Wire_Bonder]] |
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Latest revision as of 16:06, 6 November 2013
Title
Planar Concern : English Main
Description
Planar Concern history starts with the foundation of KBTEM in November 1962, a design office for precision electronic engineering in Minsk. The main activity was design, development and organization of production of the equipment for photolithographic processes and assembly operations in IC and other microelectronic devices production.
The first steps of KBTEM activities were concentrated to form a highly skilled staff and to develop all necessary infrastructure for building complex equipment, starting with research and development, manufacture of prototypes up to their commercial production, marketing and servicing of supplied systems at the customer’s site.
Combination of precision mechanics, optics, electronics, software, developement of manufacturing and R&D facilities within the first years of activity allowed to develop and provide electronic industry with the mask making equipment, mask aligners, equipment for assembly of integrated circuits (ICs) and hybrid ICs using thermocompression, ultrasonic, electropulse methods of wire bonding.
Additional Information
Related Domains
- Assembly
- Business
- Chip
- Components
- Defect Inspection
- Dicing Saw
- Die Bonder
- Electronics
- Electronics And Electrical
- Encapsulation
- Exposure
- Forcer
- Ic
- Integrated Circuit
- Lcd
- Laser
- Lens
- Mems
- Mask Aligner
- Mask Making System
- Mask Repair
- Mask Writing
- Medical Equipment
- Microscope
- Motor
- Mould
- Optical Component
- Pcb
- Package
- Pattern
- Pattern Generator
- Photolithography
- Photomask
- Prism
- Prober
- Reticle
- Smd
- Smt
- Semiconductor Device
- Semiconductors
- Silicon Wafer
- Smart Card
- Stepper
- Substrate
- Surface Mount
- Tools And Equipment
- Vlsi
- Wafer Grinder
- Wire Bonder
- Electronics and Electrical
- IC
- LCD
- MEMS
- PCB
- SMD
- SMT
- Tools and Equipment
- VLSI