Integrated Circuit (IC) electronic package development, consulting and manufacturing. Ball Grid Array (BGA), Flip chips, MEMs, EMI shielding, failure analysis and test development
Description
pulled from site's meta descriptionIC packaging solutions for challenging environments. BGAs, flip chips, MEMs, EMI shielding product development and manufacturing. Consulting services are available for failure analysis of electronic packages, Testing, and Test development, and auditing manufacturing sites
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